Palupix ™ News Center the place to share about the technology, business, and lifestyle.

Subcribe our post

Enter your email address:

Friday, January 16, 2009

AMD Offers New Semprons for Embedded Markets

Claims performance in small package

Sunnyvale, California-based Advanced Micro Devices, recently announced the immediate availability of two new processors designed for the embedded systems, namely the Sempron 210U and 200U. According to the chip maker, the new processors have been provided with a lidless BGA packaging
, featuring the low-power and high-performance capabilities that are provided by the company's Direct Connect Architecture.

“These new lidless BGA packaged processors can help customers significantly shrink their embedded design into new smaller, flatter form factors without having to sacrifice any computing performance,” said Buddy Broeker, director, Embedded Product Marketing, AMD. “Retail touch screens, self-service kiosks and digital signage are a growing part of the consumer experience and thin client computing continues to play a strong role in helping businesses become more efficient. These new processor features will help our customers stay on the cutting edge of embedded system design.”

In addition to the new AMD processors for the embedded market, the company also announced that customers could take advantage of the full performance potential of the new Semprons, with the help of the AMD M690E chipset. According to AMD, pairing the two solutions, processors and chipset, will provide for a complete and robust embedded platform that has the potential of boosting performance, while providing the increasingly necessary graphics and display options required by embedded systems.

“Whether it’s clients for cloud computing, virtual desktops, or as a green replacement for a PC, customers turn to Wyse for powerful client solutions that deliver the rich sound and graphics common with today’s applications,” said Curt Schwebke, CTO for Wyse Technology. “The new AMD Sempron 210U processors enable us to deliver high performance in a very low power thermal range, and with the BGA package, we are able to offer increasingly compact designs.”

The chip maker said that embedded systems based on its latest Sempron 210U and 200U processors were available from iBASE, aValue, EVOC, Gigabyte, and Inventec.

AMD Offers New Semprons for Embedded Markets

AMD Offers New Semprons for Embedded Markets was published by . We hope that information about AMD Offers New Semprons for Embedded Markets very usefull for you. You can get another usefull information related with AMD Offers New Semprons for Embedded Markets at our sharing post in facebook, twitter and etc.. Warm regard from us.

FeedCitrosblogDotCom

0 comments:

Post a Comment